Shimano Upper Technology
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SHIMANO footwear is developed using our unique understanding of how the foot interfaces with the shoe and the pedal to optimize comfort and maximize power transfer for smooth and efficient pedaling. Our footwear is System Engineered to function seamlessly with our SHIMANO SPD and SPD-SL pedal platforms to optimize rider performance, efficiency, and comfort for every type of rider and ride.
All SHIMANO footwear closures are anatomically designed to reduce pressure and tension on the highest points of the foot. By wrapping the foot securely, and in a uniform method, comfort is improved and added power transmission created.

The Boa® System offers infinite adjustment for a glove-like fit with on-the-fly one-handed adjustments and convenient fast release.
Powerzone is easy to adjust to a preferred forefoot fit preference. A tighter fit is available by looping the wire around the hook as shown.
Low profile reverse buckles hold the foot securely while reducing aerodynamic drag on Road footwear, and decreasing the chance of hitting obstacles on Off-Road footwear.
Unlike conventional closures, SHIMANO’s anatomically precise Offset Straps relieve tension at the highest point of the foot, where pressure tends to be greatest.

Every SHIMANO cycling shoe uses supple yet durable upper materials engineered with unique closure options to secure the foot firmly and comfortably without hot spots or pressure points.
Efficient power transfer demands a stiff and rigid sole that can result in heel slip. SHIMANO cycling footwear is engineered with lightweight internal or external 3D Anatomic heel cups, which secure the heel to eliminate slip and chafing while maximizing power transfer.
Whether it is our ultra-stiff carbon fiber DYNALAST road performance outsole, off-road tuned TORBAL outsole or on- and off-the-bike optimized city touring Explorer outsole; every SHIMANO shoe is designed with the specific user in mind.
On select models we utilize an external heel cup for enhanced heel hold and optimal durability.
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